News 2008!- NEW SOLDER WIRE FOR LEAD FREE SMT REWORK "RT15"
"AUTOFIL RT15" no clean solder wire is especially developped for SMT rework application after lead free soldering.
- Good wetting - Fast soldering
- halide free
- clear low residues
- low fume
- low odour
- low spattering
- RoHS compliant
- NEW SOLDER WAVE FLUX LF50SMT
"MBO LF50SMT" Solder flux is especially made to leave no residues after soldering. It has been developped to give high efficiency in lead free solder alloy application.
- No clean - halide free
- low fume
- No residues
- Soldering efficiency equivalent to RMA solder flux
- RoHS compliant
Lead Free Solder WiresThe new range AUTOFIL solder wires with incorporated flux is available in Lead Free Alloys
From halide free (A0 - R1) to high activated system (A11), this complete range has no-clean properties and let clear and safe residues after soldering.
| | A0 | R1 | A11 | | Halides | without | without | 1.1% | | Acid Value | 250 | 210 | 130 | | J-STD Classification | ROLO | ROLO | ROMI | | Application | SMT Rework General Application | SMT Rework General Application | Connectic on all substrates | | Alloys | Sn95.5Ag3.8Cu0.7 Sn96.5Ag3Cu0.5 Sn96.5Ag3.5 | Sn95.5Ag3.8Cu0.7 Sn96.5Ag3Cu0.5 Sn96.5Ag3.5 | Sn95.5Ag3.8Cu0.7 Sn96.5Ag3Cu0.5 Sn96.5Ag3.5 Sn99.3Cu0.7 "LOW COST" |
MBO family of no-clean solder wire "AUTOFIL" is carefully formulated to confer high activity soldering on various substrates, including, copper, tin/lead, brass, nickel, etc. Various activations are available to suit most oxidised metallization. MBO "AUTOFIL" range of solder wire confers rapid soldering with copper, tin/lead, brass and nickel.
MBO "AUTOFIL" range of solder wire can be used in conjunction with various methods of soldering, such as soldering iron, hot air, induction, hot plate and blow torch. When used with a soldering iron, it is recommended to use an operating temperature of 370°C.
Lead Free Solder PasteSIRIUS 1LF is a No-Clean & Lead Free solder paste.
Carefully formulated to solder all surfaces, SIRIUS 1LF leaves a very low volume of clear residues after soldering.This paste is designed to offer a wide process window and reduces solder defects with a minimum increase of temperature compared to lead content products.
| Characteristics | Alloys | Supplied | High speed printing: from 50 to 150 mm/s Screen life: > 12 hours Tack life: > 12 hours Abandon time: up to 12 hours Very low solder balling. Clear and very benign residues Tests and Qualifications include criteria from the J-STD-004, -005, and -006 specifications Available under dispensing version and/or RA formulation. | Sn96.5Ag3Cu0.5 Sn95.5Ag3.8Cu0.7 Sn96Ag4 | Jars of 250g, 500g Cartridges of 500g, 1Kg Proflow® cartridge system Automatic syringes 30g, 100g, 200g |
Lead Free AlloysMBO proposes a wide range of lead Free Solder Alloys for electonic industry. These Alloys meets European RoHS requirements. "LOW COST" solutions are available with very interresting technical characteristics.
| Alloys | Applications | | Sn95.5Ag3.8Cu0.7 | Wave soldering | Sn96.5Ag3Cu0.5 & Sn97Ag3 | Wave soldering | | Sn96.5Ag3.5 | Wave soldering & selective soldering | Sn99Cu SP & Sn100 SP | Wave, selective, dipping "LOW COST" | | Sn99CuHT | High temperature dipping "LOW COST" | | Sn99Cu | dipping "LOW COST" | | Sn97Cu3 | Industrial soldering "LOW COST" |
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