R Type: BC 250 RMA Type: BC 156 BC 310 BC 310- 15/35/45 FR 610 FR 601-15 TC325 CMS 2020 RA Type: BC 340 BC360 DCF201 | 40S2A 40S2S 50S2A EXEL 600 EXEL 314
LF 50 SMT-S EXEL LF7 FXL880PB Dedicated to

|  WBF01DS HYDREXEL103LF (Under Nitrogen)
WBF03T WBF320-S HYDREXEL302LF Dedicated to

| Organics
H 32 M H 35 M H 325 M H 350 M H 351 M H 330G | Inorganics
PR 102 PR 1022 PR 202 PR 2020 |
♦ Pot Dipping application (wires, conectic, etc..) ♦ automatic solder wave machines
Rosin or resin based, with alcohol solvent | No clean no residues. Solid content <4%.
♦ Dipping soldering (wires, connectic etc..) ♦ Dipping or automatic solder wave machines.
Adapted to all sodlering systems automatic or manual they are particularly dedicated to solder SMT or standard components on printed boards. | Solvant: water → Reduction of volatil organic compounds(V.O.C.) Dry extract <4% No clean and no residues
♦ Dipping or automatic solder wave machines.
This fluxes are dedicated to solder wave machines with spray fluxing systems. | Organics or inorganic, these fluxes have high efficiency. Generally halide activated, residues, watersoluble must be removed after soldering to avoid corrosion.Dedicated to soldering of highly oxidized substrates, or to components with poor wetting characteristics, these fluxes can be used on automatic solder machines or manual equipments. Genrally used in industry soldering for mechanical application as for plumbery. |