 Lead Free Solder Pastes |
No-Clean
Halide Free | Standard RMA | Standard RA | Watersoluble |
SIRIUS 1 LF
Sn96.5Ag3Cu0.5
Sn95.5Ag3.8Cu0.7
SnAg4 | 495 RMA LF
Sn96.5Ag3Cu0.5
Sn95.5Ag3.8Cu0.7 | SIRIUS 1 LF RA Di
Sn96.5Ag3Cu0.5
Sn95.5Ag3.8Cu0.7
SnAg4
595 RA | CASCADE 5 LF
Sn96.5Ag3Cu0.5
Sn95.5Ag3.8Cu0.7
SnAg4
BLOWPIPE BP100
Sn97Cu3
Sn99Cu
Sn100 |
| | | | |
Standard Leaded Alloys Solder Pastes
|
No-Clean
Halide Free | Standard RMA | Standard RA | Watersoluble |
ORION 410
SIRIUS 1 Sn62Pb36Ag2
Sn63Pb37 | 495 RMA
Sn62Pb36Ag2
Sn63Pb37 | 595 RA
SIRIUS 1RA
Sn62Pb36Ag2
Sn63Pb37 | WSP 150
CASCADE 5
Sn62Pb36Ag2
Sn63Pb37 |
| | | | |
High Temperature Solder Pastes
|
| TITAN HT12 |
Sn5Pb85SB10
Sn5Pb92.5Ag2.5
| 238°C - 243°C
296°C - 301°C
|
| | | | |
Low Temperature Solder Pastes
|
| No-Clean Halide free | No-Clean Activated |
ORION 410 Di (dispensing)
SIRIUS 1 Di (Dispensing)
Sn18PbBi50 98°C
Sn43Bi57 138°C
| SIRIUS 1 RA Di
Sn18PbBi50 98°C
Sn43Bi57 138°C
|
| | |
Dispensing Solder Pastes
|
| No-Clean Halide Free | No-Clean Activated |
SIRIUS 1 Di
721
| SIRIUS 1 RA Di
|
| | | | |
General Characteristics
|
High printing speed
Long screen life.
High tack life.
Can be reflowed under air or nitrogen
Dispensing version available | Good wetting power
Can be reflowed under air or nitrogen
Dispensing version available
| High wetting power
High activity.
Can be reflowed under air or nitrogen
Dispensing version available
| Excellent wetting.
Water soluble residues.
Can be reflowed under air or nitrogen
Dispensing version available |
