MBO Solder

Solder dipping

Solder dipping

Dipping is an operation which consists in applying a layer of tin to a metal part. 
The coating is deposited by immersion of the part in a tin bath in fusion.

In the case of tinning of large pieces, tin is used in the form of anodes (see photos of different anodes below). In particular, the use of anodes is common in electrolytic tinning applications.

anode-1.jpganode-2.jpganode-3.jpganode-4.jpganode-7.jpg

In industry, tinning is mainly used in the electric field and electronics to ensure protection against corrosion of the part (in particular for copper parts), to offer good electric conductivity and to improve the wettability of the part. 
MBO has of a wide range of alloys and fluxes adapted to the dipping process.
Current alloys (see table of solder wires). In addition we offer alloys with special additives suitable for use at higher temperatures. (HT version)

      Water soluble residues  
  Alcohol base Low residues Water base Water cleanable residues
  Rosin Organic Organic Inorganic Organic

J-STD-004
Classification

ROL0 ORLO ORLO INH1 ORL1 ORM1 ORH1
  TC 325 50S2AMS
FXL 880 PB
HYDREXEL 302 LF-H ME11
PR 303
FA 502

H32M
H35M
H350M

H351M
H352M
H330M

lorem
anode plate cannelée

Anode plate cannelée

anode plate cannelée

Anode plate cannelée

anode plate

Anode plate

anode plate

Anode plate

etamage

Etamage

Etamage

Etamage

anode eliptique cannelée

Anode eliptique cannelée