MBO Solder

Solder paste dispensing / Jet printing process

Solder paste dispensing / Jet printing process
No clean No Clean Water soluble
Lead free Lead Water cleanable residues
ROL0 ROL0 ORL0

SIRIUS1 LFP Di
SIRIUS 1 LF Di
ORION 410 Di
721
410
SIRIUS 1 LFP Di JP
ORION Di JP

 

SIRIUS 1 Di
SIRIUS 1 P Di
ORION 410 Di
721
410
TITANT HT 12Di*

CASCADE 1

* for higher temperatures melting point Pb92,5Sn5Ag2,5

P solder paste version can be stored at ambiant room temperature for up to three months.
Activated version (RA) available upon request (ROL1 classification). SIRIUS 1 MD dedicated for high temperature.

JP version dedicated to Jet printing process in type 6 (5-15µm).

  Melting point (°C)
Alloy Solidus Liquidus
Sn95SB5 235 240
Sn96.5Ag3.5 221 Eutectic
Sn96.5Ag3 Cu0.5 217 220
Sn95.5Ag3.8Cu0.7 217 Eutectic
Sn99Ag0.3Cu0.7 217 227
Sn98.5Ag0.8Cu0.7 217 224
Sn99CuSP 227 Eutectic
Sn43Bi57 139 Eutectic
Sn42Bi57,6Ag0,4 139 Eutectic
Sn42Bi57Ag1 139 Eutectic
Sn62Pb36Ag2 179 Eutectic
Sn63Pb37 183 Eutectic
Pb92,5Sn5Ag2,5 296 301
Sn18Pb32Bi50 98 Eutectic
Other on request    
  • Lead-free alloy
  • Lead alloy

lorem
dispensing auto

Dispensing auto

robot dispensing

Robot dispensing

Valve jet printing

Valve jet printing

station manuelle dispensing

Station manuelle dispensing

Texte
  • No clean solder paste with low clear residues
  • Manual or automatic dispensing
  • Can be reflowed in air or under nitrogen 
  • Different activated versions are available

MBO is offering different powder sizes from type 3 (25-45 µm) to type 6 ( 5-15µm).

Packaging :
from 10g to 100g syringe
500g, 750g and 1kg cartridge