MBO Solder

Solder paste printing

Solder paste printing
No clean No Clean Water soluble
Lead free Lead Water cleanable residues
ROL0 ROL0 ORL0

SIRIUS 1 LF
SIRIUS 1 LFP
SIRIUS 1 LFP-L
ORION 410
410

 

SIRIUS 1
SIRIUS 1 P
ORION 410
410
TITANT HT 12*

CASCADE 1LF-C

* for higher temperatures Pb92,5Sn5Ag2,5

P solder paste version can be stored at ambiant room temperature for up to three months.
Activated version (RA) available upon request (ROL1 classification).

  Melting point (°C)
Alloy Solidus Liquidus
Sn96.5Ag3.5 217 Eutectic
Sn96.5Ag3 Cu0.5 217 220
Sn95.5Ag3.8Cu0.7 217 Eutectic
Sn99Ag0.3Cu0.7 217 227
Sn98.5Ag0.8Cu0.7 217 224
Sn99CuSP 227 Eutectic
Sn43Bi57 139 Eutectic
Sn42Bi57,6Ag0,4 139 Eutectic
Sn42Bi57Ag1 139 Eutectic
Sn62Pb36Ag2 179 Eutectic
Sn63Pb37 183 Eutectic
Pb92,5Sn5Ag2,5 296 301
Sn18Pb32Bi50 98 Eutectic
Other on request    
  • Lead-free alloy
  • Lead alloy
Colonne 1
  • No clean solder paste with low clear residues
  • High speed printing
  • Long life on screen
  • Can be reflowed in air or under nitrogen
  • Different activated versions are available
  • Powder perfectly spherical and free from oxide
  • MBO offers different powder sizes from type 3 (25-45µm) to type 5 ( 15- 25µm). Other powder size available upon request.
Colonne 2

IPC tests passed (SIR, Slump test, Tackforce, Copper Mirror,  Solder balling test...)

Available packaging:

  • 250g, 500g jar
  • From 500g to 1kg cartridge
  • 2.5kg refill container
  • Proflow cartridge

 

Flux gel is suitable for use with soldering and SMD rework as well as other similar applications.

MOB 39 and FLT 396 flux gel are suitable for BGA component rework. 

These flux gel are no clean and halogen free (ROLO according to J-STD-004) leaving low  residues that are non-corrosive.

Supplied in syringes of 5g, 10g and in 100g, 200g, 400g and 1kg jar

Titre
Applications

Sérigraphie

Machine de sérigraphie

machine de sérigraphie

Machine de sérigraphie

MSP-250 sérigraphie manuelle

MSP-250 sérigraphie manuelle