DIE ATTACH solid wires
Major advantages of the MBO Preform solid wires :
- High purity and free of oxides
- Free of organic contamination on solid wire surface (elaborated extrusion process constantly improving by MBO engineers)
- Wide range of available diameters (from 18 mils to 40 mils). Others diameters possible on request.
- Low voiding solid wire (< 5 %).
- Fully compatible with automatic wire dispensing machine.
General characteristics :
The reliability of electronic components is crucial. Thermal and mechanical fatigue are key parameters in the occurrence of defects.
A perfect joint is very important to get the best thermal performance. Good wetting as well as low void rates help to create a solder connection with highest reliability. MBO provide solid soft solder wires that are flux free and especially optimized for high performance components and die attach applications. They are manufactured by a controlled process in order to ensure the optimal quality.
Physical characteristics :
|Alloy||Tin||Lead||Silver||Melting point||Specific weight|
|Sn5Pb92.5Ag2.5||5% ± 0,2%||Reste||2,5% ± 0,1 %||288°C - 296°C||11 g/cm3|
|Other on request|
Global Material purity: 99.99 %
Packaging / storage:
Solid wire: On special reels dedicated to die attach application
Diameter in mils (18 to 40) in various lengths.
Storage: In original packaging at room temperature for 12 months.
Material Safety Data Sheet available on request. Please consult it before use
Quality Certificate available on request.
DIE ATTACH OP9 M Di solder paste
DIE ATTACH OP9 M Di solder paste :
Major advantages of the MBO DIE ATTACH solder paste:
- Very good behaviour in dispensing
- No clean and halogen free formulated
- Extra clear and colourless residues
- Low voiding for long term reliability solder joint
Organic No Clean OP9 M Di solder paste has been developed in the MBO laboratories. It is specially designed to offer a high level of activity while leaving very low residues, very clear and non-corrosive. This product, suitable for dispensing, meets the international requirements of the electronics industry.
- ORL0 classification according to J-STD-004
- Halide free.
- REACH compliant
- High activity.
- Very low residues, neutral and colorless.
Organic No Clean OP9 M Di solder paste is manufactured in strict compliance with current international standards.
ISO 9453 (2014)
|Melting point (°C)||Metal content (%)||Viscosity (Pas) Brookfield 20°C 5 rpm|
84 - 85
84 - 85
|Other: consult us|
|Activity Level (classification)||IPC J-STD-004||
|Halide free (by titration)|
|Copper Mirror||IPC-TM-650 (2.3.32) /J-STD-004||Pass (no evidence of corrosion)|
|Silver Chromate||IPC-TM-650 (2.3.33)||Pass|
|Surface Insulation Resistance Test (SIR)||GR 78 Core Section 13, 220.127.116.11||Pass|
|Visual aspect of
|Viscosity||Brookfield viscometer (20°C – 5 rpm)||190 Pa.s (Sn5Pb92.5Ag2.5)|
|Solder ball test||IPC TM 650 2.4.43||Pass|
|Solder wetting test||IPC TM 650 2.4.45||Pass|
OP9 M Di solder paste is suitable for all dispensing machines equipped with needles up to 0.41 mm in diameter (class 5 metal powder).
5 cc, 10 cc, 30 cc syringes. Other on request.
18-22°C and 35% to 70% RH.
Cleaning of tools:
Most standard cleaning products. Also possible with hot water.
In original packaging, between 5 and 10 ° C, for up to 6 months. Wait until the syringes are at room temperature before use to avoid condensation on the paste. Storage at room temperature : 7 days maximum.
Our manufacturing processes have been subjected to FMECA analysis (equivalent of AMDEC in France).
Convection, infrared, vapour phase, hot plate, hot bar, laser and others. Aerobic or inerted.
See suggested reflow profile.
Most cleaners. Also hot water can be used.
Temperature : 35-60°C.