Wave soldering / Selective soldering

Wave soldering / Selective soldering
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MBO Alloys:

  • Manufactured by selecting highest purity base metals and by using virgin materials.
  • Produced in a rigorously controlled process to ensure the lowest oxide level.
  • Alloy composition checked by ICP- AES.

For the current alloys, go to solder wires section to find the requested alloy in the table.

Alloy forms:

  • Bars,
  • Ingots,
  • Sticks,
  • Solid wires,
  • Pellets,
  • Domes
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Lead free Alloys

  • Different alloys are available (SAC305, SAC387, SAC0307, Sn99Cu, Sn97Cu3, Sn95Sb5)
  • Lead free alloy without any silver content : Sn99CuSP PLUS “high performances”.

Desoxidising tablets (DESOXY SP and DESOXY SP PLUS) are available to reduce the surface oxydation of the solder bath (Contact MBO team to select the right part compatible with your solder bath)

  Alcohol No clean and low residues Water cleanable residues
  Rosin Rosin Organic Organic
  BC 250

BC 156
BC 310
BC 310.15
BC 310.35
FR 601
FR 719
CMS 2020

BC 340 BCX5M
FXL 248
40S2, 40S2A, 40S2AM, 40S2S
50S2A, 50S2AMS
LF 40, LF 50-SMT(S)
EXEL 112 SO, EXEL 314
FXL 880 PB


  • Alcohol base
  • Low rosin content 
  • Suitable for lead and lead free process
  • Alcohol base
  • Halide free
  • Tests passed due to no rosin content
  • Non dangerous product > Easy to handle for transportation
  • Full water base flux. VOC free
  • Suitable for wave soldering and selective soldering process
  • Tests passed due to no rosin content
  • Compatible with spray and foam process
  • No required density control

adaptation tete de vague brasage

adaptation tete de vague brasage


Thinners are used with MBO flux to stabilize the alcohol based flux density (D40S, D305, FD80).

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The purpose of the flux is to facilitate the soldering process. One of the obstacles to a successful welding joint is an impurity at the interface of the solder, for example, dirt or oxidation. The impurities can be removed by mechanical or chemical cleaning, but the high temperatures required to melt the filler metal (solder) can cause a re-oxidation phenomenon. This effect is accelerated by the increase of the brazing temperature and may in certain cases prevent the welding from being carried out. Some fluxes prevent oxidation and also provide some form of chemical cleaning (against corrosion).

For many years and still today, the most common type of flux used in electronics (soft brazing) was rosin, natural resin from selected pines. This resin is ideal because it is non-corrosive and non-conductive at normal temperatures (25 °C to 65 °C) but becomes slightly reactive (corrosion) at high welding temperatures. Plumbing and automotive applications, among others, generally use a strong acid-based flux (eg, hydrochloric acid) for cleaning the workpiece to be welded.

These fluxes cannot be used in electronic devices because they are conductive and because they eventually dissolve small diameter wires. In this case, it is necessary to clean the welding residues. Many fluxes also act as a wetting agent in the welding process by reducing the surface tension of the molten filler metal and thus allowing it to better distribute on the parts to be soldered.

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In the case of soft soldering, the fluxes are classified into 3 main families:

Water-soluble fluxes: these fluxes have a high activity and require cleaning of the residues (with water) after soldering/welding to avoid any phenomenon of corrosion over time.

No Clean fluxes:
These fluxes are "soft enough" not to "require" the removal of their residues due to their non-conductive and non-corrosive nature. These fluxes are called "NO CLEAN" because the residues left after the welding operation is non-conductive and will not cause an electrical short circuit. Nevertheless, they leave a residue going from white to dark brown (depending on the soldering temperature) clearly visible.

The rosin-based fluxes:
Typical rosin-based fluxes are available in a non-activated version (R = Rosin), slightly activated (RMA = Rosin Mildly Activated), RA = Rosin Activated. The RA and RMA formulations contain rosin combined with an activating agent, typically an acid, which increases wettability to the metals to which it is applied by removing existing oxides. The flux is formulated to give a residue that is generally non-corrosive, resulting in optional cleaning of these residues.
The performance of a flux must be carefully evaluated: a very "soft" NO CLEAN flux can be perfectly suited for automatic production equipment but does not give satisfactory results for a badly controlled manual soldering/welding operation.

Complementary products

Solution to protect surface from solder : Peelable mask
Used to temporarily protect areas of the PCB or components from the adhesion of solder. 
Formulated with natural latex

  • MSP75
  • MSP75 Opaque
  • MSP75 neutral
  • MSP R93-B

SPEED version is also available to reduce drying time of 20%.

Available in 250ml bottle and 5kg drum.